| PART |
Description |
Maker |
| ADFC22 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| ADFC13 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| ADFC31 |
MULTI-LAYER DIELECTRIC FILTER
|
ABRACON[Abracon Corporation]
|
| ACML-1206-90 ACML-1206-1000 ACML-1206-11 ACML-1206 |
1 FUNCTIONS, 2 A, DATA LINE FILTER
SURFACE-MOUNT MULTI-LAYER CHIP BEADS
|
ABRACON[Abracon Corporation]
http://
|
| CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CYV15G0403DXB CYP15G0403DXB-BGC CYV15G0403DXB-BGI |
Physical Layer Devices : Video (SMPTE) PHYs
Physical Layer Devices : Multi-Protocol PHYs
Independent clock quad HOTLink II transceiver. Speed standard.
|
Cypress
|
| 2506031017Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp.
|
| 2508053017Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp...
|
| CTMCA3216 CTMCA3216-2R4 CTMCA3216-4R9 |
Multi-layer Chip Antennas
|
Central Technologies
|
| CL21A106KPFNNNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
| CS1005X7R104B100NBA CS1005X7R104B100NBB CS1005X7R1 |
Multi Layer Ceramic Capacitors
|
SAMWHA ELECTRIC
|
